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適用領域：集成電路、先進封裝 Relevant Industries: Integrated Circuits, Advanced Packaging 適用材料: ?Si Suitable for Processing: Silicon (Si) 晶圓尺寸：12/8 英寸 Wafer Size:12/8 inch 適用工藝：氮化硅(SiN)、多晶硅(Poly-Si/U-Poly/D-Poly)、 二氧化硅(TEOS)等 Applicable Processes: Silicon Nitride (SiN) Deposition, Polysilicon(Poly-Si / U-Poly /D-Poly) Deposition, Silicon Dioxide (TEOS) Deposition etc.